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• Airflow optimized front
If loads of power
0 – INTEGRATING WITH THE SYSTEM ENVIRONMENT
The VSK3000E-U3 meets Thermally Advantaged Chassis (TAC) 2
ASUS MB PRIME H570M-PLUS CSM H570 LGA1200 Max.128GB DDR4 HDMI DP W10 microATX CF2 • Airflow optimized front1. Intel LGA 1200 socket: Ready for 11th Gen Intel Core processors 2. Enhanced power solution: 8 power stages, alloy chokes and durable capacitors for stable power delivery 3. Comprehensive cooling: VRM heatsink, M. 2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+ 4. ASUS OptiMem: ASUS OptiMem proprietary trace layout allows memory kits to operate at higher frequencies with lower voltages to maximize system performance 5. Ultrafast
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